Lists
Lists
Alibakhshikenari, Mohammad, Virdee, Bal Singh, See, Chan, Fishlock, Sam Jeffery, Soin, Navneet, McLaughlin, James, Abd-Alhameed, Raed and Limiti, Ernesto (2019) Amalgamation of metamaterial and SIW technologies for realizing wide-bandwidth and high-radiation properties of on-chip antennas for application in packaging of terahertz components. In: 8th Asia-Pacific Conference on Antennas and Propagation, 4 - 7 August 2019, Incheon, Korea.
This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of -35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.
Available under License Creative Commons Attribution Non-commercial No Derivatives 4.0.
Download (347kB) | Preview
 |
View Item |