A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits

Brinson, Mike, Forrest, J. R., Parsons, A. J. and Salles, A. A. (1980) A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits. Colloquim on Thick-film microwave integrated circuits. 5/1-5/4.

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Abstract / Description

In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented.

Item Type:	Article
Uncontrolled Keywords:	microwave integrated circuits; active phased array radar systems; thick film technology; conductor materials; fritless conductor inks
Subjects:	600 Technology > 620 Engineering & allied operations
Department:	School of Computing and Digital Media
Depositing User:	Mike Brinson
Date Deposited:	07 Nov 2019 09:15
Last Modified:	07 Nov 2019 09:15
URI:	https://repository.londonmet.ac.uk/id/eprint/5290

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