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A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits

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Brinson, Mike, Forrest, J. R., Parsons, A. J. and Salles, A. A. (1980) A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits. Colloquim on Thick-film microwave integrated circuits. 5/1-5/4.

Abstract

In this paper an outline of X band and S band thick film active phased array modules, based on the phased locked principle, are presented.

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5290:28086
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Title:
A comparison of Au, Ag, Pd-Ag and Cu thick film microwave integrated circuits
Creators:
Brinson, Mike, Forrest, J. R., Parsons, A. J. and Salles, A. A.
Date:
7 May 1980
Subjects:
600 Technology > 620 Engineering & allied operations
Department:
School of Computing and Digital Media
Publisher:
IEE (Professional group E12)
Uncontrolled Keywords:
microwave integrated circuits; active phased array radar systems; thick film technology; conductor materials; fritless conductor inks
Record
URI:
https://repository.londonmet.ac.uk/id/eprint/5290
Item Type:
Article
Depositing User:
Mike Brinson
Date Deposited:
07 Nov 2019 09:15
Revision:
11
Last Modified:
07 Nov 2019 09:15
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