Amalgamation of metamaterial and SIW technologies for realizing wide-bandwidth and high-radiation properties of on-chip antennas for application in packaging of terahertz components

Alibakhshikenari, Mohammad, Virdee, Bal Singh, See, Chan, Fishlock, Sam Jeffery, Soin, Navneet, McLaughlin, James, Abd-Alhameed, Raed and Limiti, Ernesto (2019) Amalgamation of metamaterial and SIW technologies for realizing wide-bandwidth and high-radiation properties of on-chip antennas for application in packaging of terahertz components. In: 8th Asia-Pacific Conference on Antennas and Propagation, 4 - 7 August 2019, Incheon, Korea.

Preview

Text Manuscript I_APCAP2019_Final.pdf - Accepted Version Available under License Creative Commons Attribution Non-commercial No Derivatives 4.0. Download (347kB) | Preview

Abstract / Description

This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of -35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	on-chip antenna; metamaterial; substrate integrated waveguide; terahertz; wideband; high-efficiency; silicon; feeding mechanism
Subjects:	600 Technology > 620 Engineering & allied operations
Department:	School of Computing and Digital Media
Depositing User:	Bal Virdee
Date Deposited:	26 Jul 2021 08:41
Last Modified:	26 Jul 2021 08:41
URI:	https://repository.londonmet.ac.uk/id/eprint/6883

Downloads

Actions (login required)

View Item