Qucs, SPICE and Modelica equation-defined modelling techniques for the construction of compact device models based on a common model template structure

Brinson, Mike, Jahn, Stefan and Nabijou, Hassan (2011) Qucs, SPICE and Modelica equation-defined modelling techniques for the construction of compact device models based on a common model template structure. In: Arbeitskreis MOS-Modelle und Parameterextraktion MOS Modeling and Parameter Extraction Working Group MOS-AK/GSA Workshop on "Frontiers of the Compact Modeling for Advanced Analog/RF Applications.., 7 - 8 April 2011, Université Pierre et Marie Curie (UPMC), Paris..

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Abstract / Description

Current releases of the popular Qucs GPL circuit simulator, the freely available LTspice IV simulator and the open source OpenModelica physical simulation package offer substantial compact semiconductor device modelling capabilities, including equation defined macromodelling facilities and access to either Verilog-A code or Modelica language compilers. This paper introduces a compact modelling technique based on a model template structure which exploits common hardware description language features found among a number of the current freely available simulation packages. An extended version of the standard SPICE diode model is used to demonstrate the power and modelling flexibility of the proposed template model. The cross-package modular approach to compact semiconductor device modelling presented in this paper also stresses the role new modelling techniques will take on as simulator technology evolves in the future.

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	Quite universal circuit simulator (Qucs), equation­-defined device modeling, compact semiconductormodels, circuit macromodels, Verilog­-A
Subjects:	600 Technology > 620 Engineering & allied operations
Department:	School of Computing and Digital Media
Depositing User:	Mike Brinson
Date Deposited:	30 Oct 2019 11:35
Last Modified:	31 Oct 2019 09:08
URI:	https://repository.londonmet.ac.uk/id/eprint/5248

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